Laminate: FR4

Board thickness: 1.6mm (.062-inch)

Copper thickness: 35um (1oz) copper for all layers after finish

Copper wall in the hole: 20um (0.8 mil)

Solder resist: SMOBC

Finish:

Immersion gold Ni: 3 to 5um

Au: 0.05um (Ni: 120 micro inch/Au: 2 micro inch)

Trace width/width: 0.15/0.15mm (6/6 mil)