Introduction

The modern production facility of Epotek is designed to achieve breakthroughs in top efficiency. The competitive advantages of Epotek lie in transferring lower cost, higher production efficiency, and lower defects into customer savings.Epotek devotes to deliver higher quality products at lower cost because customer priority and customer satisfaction are the main motto of Epotek. Epotek has long term contracts with air courier company such as FedEx, UPS and DHL etc, provide our customers the soonest delivery and the cheapest transportation charge.

Factory Capability Rigid PCB Flex PCB
Layers Single ~ 50L Single ~ 6L
Base Material FR-4/Hi-Tg/Halogen Free/Metal Core/Ceramic/Tefelon/Polymide Polymide, Polyester
Max. WP Size 546.10mm x 622.40mm(21.5" x 24.5") 0.075mm~0.40mm (0.003"~0.016")
Finished Board Thickness 0.3mm~5.0mm (0.012"~0.197") +- 0.05mm / +- 0.10mm
Board Flatness Tolerance 0.50% N/A
Inner Layer Copper Thickness 4/4 oz 0.5/0.5 oz
Outer Layer Copper Thickness 5/5 oz 1/1 oz
Min. Finished Hole 0.15mm 0.20mm
Max. Copper Wall Plating 2 oz N/A
Min. Trace/Space (outer Layer) 3.0/3.0 mil 4.0/4.0 mil
Min. Trace/Space (Inner Layer) 2.5/2.5 mil 3.0/3.0 mil
Surface Finish HASL/HASL(Lead Free); ENIG;Immersion Silver/Tin; OSP; Gold Plating; Gold Finger;
Peelable Mask; Carbon Ink		 HASL/HASL(Lead Free); ENIG;Gold Plating;
Immersion Tin; OSP
Impedance Control +/- 10% N/A